激光植球工艺参数的有限元分析

Finite Element Analysis of the Process Parameters of Laser Soldering Ball

激光植球工艺作为一种新型工艺,广泛地应用于机械、航天和船舶等领域。然而,由于焊接质量不稳定和焊点一致性差等原因,还需不断地调整工艺参数、改进工艺方法。采用有限元法对焊球模型施加旋转高斯体热源,进行瞬态热分析和静力学分析,研究激光植球过程中激光高度、功率和作用时间对Sn63Pb37焊球在Au/Ni/Cu焊盘的焊点可靠性的影响。通过正交试验简化试验流程,并引入信噪比分析试验数据。结果表明,激光作用时间对焊点温度场与应力场的影响最为显著。同时,还得到3种因素的最佳设计方案。期望对激光植球工艺的改进与优化提供一定的理论支撑。

As a new type of process,the laser ball implantation process is widely used in the fields of machinery,aerospace and shipbuilding.However,due to the unstable welding quality and poor consistency of welded joints,it is necessary to continuously adjust the process parameters and improve the process method.The finite element method is used for applying the rotating Gaussian volume heat source to the solder ball model,and the transient thermal analysis and static analysis are carried out to study the effect of laser height,laser power and action time on the reliability of the solder joints of Sn63Pb37 solder ball on the Au/Ni/Cu pad during the laser implantation process.The orthogonal test is used to simplify the test process,and the signal-to-noise ratio is introduced to analyze the test data.The result shows that the laser action time has the most significant effect on the temperature field and stress field of the solder joint.At the same time,the optimal design scheme of three factors is obtained.It is expected to provide some theoretical support for the improvement and optimization of the laser ball implantation process.