一种涂胶封装半导体绑定金线断裂失效原因分析及改善方法

Failure Reason Analysis and Improvement Method of Bonding Gold Wire for a Semiconductor Encapsulated with Protective Adhesive

在半导体封装工艺中,芯片键合是非常关键的一环,其中绑定是芯片键合的一种普遍方式,它用高纯度金线把芯片接口和基板接口键合,从而实现信号的传输和电气连接[1]。然而使用过程中绑定容易出现一些故障,金线断裂是绑定常见的故障原因之一。本文通过对一种PCBA上涂有防护胶的传感器进行不良解析,采用故障树梳理金线断裂的可能因素,结合CT扫描、金线断面SEM对比分析等方式,找出金线颈部断裂的根本原因并提出改善方法,为金线断裂分析提供了一种有效的解析方式。

In semiconductor encapsulation technology,chip bonding is a crucial step,and bonding is a common method of chip bonding.It uses high-purity gold wire to bond the chip interface and substrate interface,thereby achieving signal transmission and electrical connection[1].However,bonding is prone to some faults during use,and gold wire breakage is one of the common causes of bonding failures.This article analyzes the defects of a PCBA sensor coated with protective adhesive,uses a fault tree to sort out the possible factors of gold wire fracture,and combines CT scanning,and SEM comparative analysis of gold wire cross-section to identify the root cause of gold wire neck fracture and propose improvement methods,providing an effective analysis method for gold wire fracture analysis.