某型号MIC控制板开路故障的研究分析与改进

Analysis and Improvement About Open Circuit Fault of One Type MIC Control Board

文章介绍了某型号MIC控制板的故障研究分析流程,经研究分析,该故障为硅麦器件芯片SMT虚假焊和键合工艺缺陷导致开路所引起引起。作者通过外观检查、电性能测试、X-ray透视、CT扫描检查和切片分析等失效分析手段,了解失效产品故障现象,确定分析手段及方法,找出了产品失效的根本原因,并为企业提出了有针对性的改进方案,产品改善后,避免了类似故障的再次发生。

This paper introduces analysis and improvement process of one type of MIC control board.Through research and analysis,we found that the open circuit fault is caused by and SMT false welding and bonding process defects of silicon wheat chip.The Researchers used failure analysis methods,including appearance inspection,electrical performance test,X-ray fluoroscopy,CT scan inspection and section analysis,determined the analysis means and methods and find out the root cause of failure.After the manufacturer accepted the suggestion and improved the product,the similar failure was avoided again.