摘要
Multidimensional integration and multifunctional com-ponent assembly have been greatly explored in recent years to extend Moore’s Law of modern microelectronics.However,this inevitably exac-erbates the inhomogeneity of temperature distribution in microsystems,making precise temperature control for electronic components extremely challenging.Herein,we report an on-chip micro temperature controller including a pair of thermoelectric legs with a total area of 50×50μm^(2),which are fabricated from dense and flat freestanding Bi2Te3-based ther-moelectric nano films deposited on a newly developed nano graphene oxide membrane substrate.Its tunable equivalent thermal resistance is controlled by electrical currents to achieve energy-efficient temperature control for low-power electronics.A large cooling temperature difference of 44.5 K at 380 K is achieved with a power consumption of only 445μW,resulting in an ultrahigh temperature control capability over 100 K mW^(-1).Moreover,an ultra-fast cooling rate exceeding 2000 K s^(-1) and excellent reliability of up to 1 million cycles are observed.Our proposed on-chip temperature controller is expected to enable further miniaturization and multifunctional integration on a single chip for microelectronics.
基金
The authors thank D.Berger,D.Hofmann and C.Kupka in IFW Dresden for helpful technical support.H.R.acknowledges funding from the DFG(Deutsche Forschungsgemeinschaft)within grant number RE3973/1-1.Q.J.,H.R.and K.N.conceived the work.With the support from N.Y.and X.J.,Q.J.and T.G.fabricated the thermoelectric films and conducted the structural and compositional characterizations.Q.J.prepared microchips and fabricated the on-chip micro temperature controllers.Q.J.and N.P.carried out the temperature-dependent material and device performance measurements.Q.J.and H.R.performed the simulation and analytical calculations.Q.J.,H.R.and K.N.wrote the manuscript with input from the other coauthors.All the authors discussed the results and commented on the manuscript.
