基于电磁仿真的红外成像电路板优化设计

Optimized Design of Infrared Imaging Circuit Board Based on Electromagnetic Simulation

致力于通过仿真技术对红外成像电路板(Printed Circuit Board,PCB)进行优化,以提高其抗电磁干扰(Electromagnetic Interference,EMI)能力。基于ANSYS SIWAVE仿真平台,聚焦于识别并解决PCB在电磁环境中可能面临的问题,以提高系统的可靠性和性能。首先,通过对PCB进行模态分析和频域分析,识别了潜在的谐振频率和电磁辐射点。接着,通过添加去耦电容的方式来消除该谐振频点,再通过对高速信号过孔孔径的仿真研究,调整布线方案、优化信号传输路径并对关键信号线进行保护,降低了信号失真和时序问题的风险。仿真结果表明,这些优化措施在提高PCB性能和稳定性方面取得了显著的效果。

This research is devoted to optimizing PCB with simulation technology to improve its anti-electromagnetic interference ability.Based on the ANSYS SIWAVE simulation platform,we focus on identifying and solving problems that PCB may face in electromagnetic environments to improve system reliability and performance.First,the potential resonant frequencies and electromagnetic radiation points are identified through the modal analysis and frequency domain analysis of PCB.Then,the resonant frequency point is eliminated by adding decoupling capacitors.The wiring scheme is adjusted,the signal transmission path is optimized,and the key signal lines are protected by simulation research on the high-speed signal aperture,which reduces the risk of signal distortion and timing problems.The simulation results show that these optimization measures have achieved remarkable results in improving PCB performance and stability.