OSP前处理微蚀对镀镍金悬垂的腐蚀能力研究

Research on corrosion to overhang of Nickel and Gold plating caused by micro etching chemical in OSP process

电子设备中带有连接插头的印制电路板设计有多种混合表面处理,其中插头镀金+OSP工艺较为常见。在此类电路板做OSP之前,通常需要将插头镀金区域用高温胶带覆盖,防止微蚀前处理药水腐蚀插头部位的镍金悬垂,此操作需要贴胶带和撕胶带,不仅影响生产效率,也增加了生产成本。经过研究不同体系的微蚀药水对镍金悬垂的腐蚀能力,优化了微蚀前处理配方,使得插头镀金板做OSP时不用贴胶带,因此提升了生产效率。

The printed circuit boards with connecting plug among electronic equipment are designed with various mixture surface treatment,gold finger plating(GFP)plus organic solderability preservatives(OSP)is one of the familiar process.Before this type PCBs coating OSP,it generally needs to paste high temperature tape to cover the gold plating area in order to prevent micro etching pretreatment chemical attacking nickel and gold overhang of GFP.The operation need paste and remove tape that not only affect production efficiency,but also increase production cost.Through researching the corrosion capability to Nickel and Gold plating overhang among different systemic micro etching chemical and optimizing the recipe of micro etching chemical,it contributes to no taping GFP when connecting plug PCBs run OSP process,and so as to improve productivity.