基于FAHP的表贴器件焊点质量评估

Quality Evaluation of Solder Joint on Surface Mount Device Based on FAHP

为了准确检验评估电路板上表贴器件焊点质量的影响因素,更好地提高和改善焊点质量,对表面贴装技术过程中的部分重要影响因素进行识别归类,利用层次分析法构建焊点质量的影响因素权重模型,再结合模糊综合评判法,评估出各因素对焊点质量的影响水平,得出基于模糊层次分析法(FAHP)的表贴器件焊点质量的评估模型。对某型电路板表贴制程下的焊点质量进行评估模型应用,得出焊点质量的评估结果。通过对评估过程和结果的分析,当需对焊点质量进行改进时,可按照模型中的权重信息实现快速定位,使得提供的工艺解决方案也变得更加具有理论依据。

In order to accurately inspect and evaluate the influencing factors of solder joint quality of surface mount devices on circuit boards,and to better improve and improve solder joint quality,some important influencing factors in the process of surface mount technology are identified and classified.A weight model of influencing factors for solder joint quality is constructed using Analytic Hierarchy Process,and then combined with fuzzy comprehensive evaluation method,the impact level of each factor on solder joint quality is evaluated,an evaluation model for solder joint quality of surface mount devices based on Fuzzy Analytic Hierarchy Process(FAHP)is developed.An evaluation model to the solder joint quality during the surface mounting process of a certain type of circuit board is applied,and the evaluation results of solder joint quality is obtained.By analyzing the evaluation process and results,when it is necessary to improve the quality of solder joints,rapid positioning can be achieved based on the weight information in the model,making the provided process solution more theoretically sound.