新型大功率IGBT用有机硅凝胶的性能

Properties of New Silicone Gel for High-power IGBT

有机硅凝胶凭借其优异的耐热性能和机械性能,广泛应用于IGBT器件的封装。详细介绍了有机硅凝胶的基本性能,采用Arrhenius方程计算出硅凝胶的表观活化能为23.16kJ/mol,具有较好的反应活性,通过热重曲线分析硅凝胶在200℃内基本没有分解,具有良好的耐热性能。应用到大功率IGBT模块中,通过复杂的力学和电性能应用性测试后,IGBT模块仍有较好的稳定性。最后对灌封后的IGBT模块进行力学和热学仿真,热仿真的结壳热阻为0.1044℃/W,机械冲击仿真最大值为349.86MPa,随机振动仿真最大值为6.2002MPa。该研究也将为硅凝胶在大功率IGBT功率器件的封装设计中提供重要的实用信息。

Organic silicon gel is widely used in the packaging of IGBT devices due to its excellent heat resistance and mechanical properties.The basic properties of silicone gel is introduced in detail.The apparent activation energy of silicone gel calculated by Arrhenius equation is 23.16 kJ/mol,which has good reaction activity.According to the thermogravimetric curve analysis,silicone gel basically does not decompose at 200℃,and has good heat resistance.Later,it is applied to high-power IGBT module,and after complex mechanical and electrical performance testing,the IGBT module still showes good stability.Finally,mechanical and thermal simulations are conducted on the sealed IGBT module,the thermal resistance of the shell in the thermal simulation is 0.1044℃/W,the maximum force in the mechanical impact simulation is 349.86 MPa,and the maximum force in the random vibration simulation is 6.2002 MPa.This research will also provide important practical information for the packaging design of silicon gel in high-power IGBT power devices.