基于ANSYS的振动载荷下车用IGBT模块的应变响应分析

Strain Response Analysis of IGBT Module under Vibration Load Based on ANSYS

为了实现车用IGBT模块在振动环境下的应变响应分析,建立了4组DBC绝缘层分别采用Al_(2)O_(3)、AlN、Si_(3)N_(4)、BeO的IGBT模块模型,选取芯片焊料层这一重要构件,运用有限元仿真软件对其进行了模态分析、谐响应分析及随机振动分析。结果表明,DBC绝缘层材料的改变对IGBT模块整体结构的固有频率影响并不明显,绝缘层采用AlN的IGBT模块抗振性能较弱。在随机振动载荷下,IGBT模块芯片焊料层的危险点均在右下角;DBC绝缘层采用BeO材料的IGBT模块抗振性能较好。

To realize the strain response analysis of vehicle IGBT module under the vibration environment,this paper establishes a IGBT module model with four groups of DBC insulating layer adopting Al_(2)O_(3),AlN,Si_(3)N_(4)and BeO respectively.Modal analysis,harmonic response analysis and random vibration analysis of chip solder layer are carried out by using finite element simulation software.The results show that the change of DBC insulation material does not obviously affects the natural frequency of the overall structure of IGBT modules.The IGBT module of AlN for the insulation layer has a weak anti-vibration performance.Under the random vibration load,the dangerous points of the solder layer of the chip of the IGBT module are all in the lower right corner;the vibration-resistant performance of the IGBT module whose DBC insulation layer is made of BeO material is better.