射频组件用键合金带的研究进展

Research Progress of Bonding Au Ribbon for Radio Frequency Components

射频组件的飞速发展促进了5G通信技术的推广应用。金带作为射频组件封装用关键键合材料,将板级系统集成于1个完整的组件电路系统中,对组件尺寸和性能起着至关重要的作用。目前键合金带的研究与开发已经成为学术界和产业界的研究热点,对近年来射频组件用键合金带在工业应用中的研究进展进行论述和分析,归纳了微量元素对金带的强化机理和对键合性能的影响。重点介绍了键合金带与键合金丝的微波特性,在相同条件下,键合金带的信号传输能力优于金丝,尤其是在高频段(20GHz以上)键合金带信号传输能力更加显著。对键合金带的制备工艺和工程应用中遇到的问题进行了梳理,总结了键合金带未来的发展趋势。

The rapid development of radio frequency components has promoted the widespread application of 5G communication technology.As a key bonding material for radio frequency component packaging,Au ribbon integrates the board-level system into a complete component circuit system and plays a crucial role in component size and performance.At present,the research and development of bonding Au ribbon have become a research hotspot in academia and industry.The research progress of bonding Au ribbon for radio frequency components used in industrial applications in recent years is discussed and analyzed,the strengthening mechanism on Au ribbon and the impact on bonding performance of trace elements are summarized.The microwave characteristics of bonding Au ribbon and bonding Au wire are highlighted.Under the same conditions,bonding Au ribbon has better signal transmission capability than bonding Au wire,especially in the high-frequency band(above 20 GHz)the signal transmission capability of bonding Au ribbon is more significant.The problems encountered in the preparation process and engineering applications of bonding Au ribbon are reviewed,and the future development trend of bonding Au ribbon is summarized.