混合集成电路的自动上芯吸嘴开发

Development of Automatic Chip Loading Nozzles with Hybrid Integrated Circuits

芯片贴装是微电子元器件封装工艺流程中的关键环节,贴装后芯片的可靠性对电路整体性能及质量具有重要影响。介绍了1种适用于厚膜混合集成电路的自动上芯吸嘴,该吸嘴基于IP-500型自动上芯机,针对厚膜混合集成电路和国产裸芯片的特点进行研发。从自动上芯吸嘴的结构和材料入手,利用有限元仿真软件计算压力并对吸嘴和芯片的应力分布情况进行重点分析。结果表明,优化后的橡胶吸嘴能有效解决国产裸芯片在自动上芯过程中发生损伤的问题。

Chip mounting is a key link in the packaging process of microelectronic component,and the reliability of the chip after mounting has an important impact on the overall performance and quality of the circuit.An automatic chip loading nozzle for thick-film hybrid integrated circuits is introduced,which is based on the IP-500 automatic chip loading machine and is developed for the characteristics of thick-film hybrid integrated circuits and domestic bare chips.Starting from the structure and material of the automatic chip loading nozzle,the finite element simulation software is used to calculate the pressure and focus on the stress distribution of the nozzle and the chip.The results show that the optimized rubber nozzle can effectively solve the problem of damage occurring in the automatic chip loading process of domestic bare chips.