机车牵引控制单元控制芯片热分析及仿真

Thermal Analysis and Simulation of Locomotive Traction Control Unit Control Chip

本文对机车牵引控制单元核心控制电路板卡上高速处理器芯片进行散热设计和仿真研究,并对不满足散热需求的热设计进行改进。通过对比热仿真结果和实际应用环境下的芯片温升,充分验证了热仿真对散热设计具有指导意义。

This article conducts heat dissipation design and simulation research on the high-speed processor chip on the core control circuit board of the locomotive traction control unit,and improves the thermal design that does not meet the heat dissipation requirements.By comparing the simulation results of specific heat and the temperature rise of chips in practical application environments,it is fully verified that thermal simulation has guiding significance for heat dissipation design.