低成本无卤中损耗级覆铜板的开发

Development of low⁃cost halogen-free and mid-Loss grade copper clad laminate

采用多官能环氧树脂、含磷环氧树脂、低介电固化剂、低介电阻燃剂和无机填料组成无卤低介电配方,制得的覆铜板(CCL)具有中Tg、中等损耗级、优异的耐热可靠性和极低的热膨胀系数(CTE),阻燃性能可达到UL-94V-0级,满足消费类电子印制电路板(PCB)的应用需求,且成本较低,具备良好的市场前景。

In this paper,multi-functional epoxy resin,phosphorous epoxy resin,low dielectric curing agent,low dielectric flame retardant and inorganic filler are used to form a halogen-free low dielectric formula.The prepared copper clad laminate has medium Tg,mid-Loss grade,excellent thermal reliability and very low coefficient of thermal expansion,and its flame retardant performance reaches UL-94 V-0 grade.It can meet the application needs of consumer electronics printed circuit board(PCB)and the cost is low,so it has a very good market prospect.