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半导体工业生产中的人因工程风险与挑战

Human Factors-related Risks and Challenges in the Semiconductor Manufacturing Process
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摘要 半导体生产过程具有工艺复杂、自动化程度高、操作精度高等特点。从事该生产过程的工人面临许多生理与心理方面的风险。从人因工程的角度出发,首先,结合产线中工人的工作内容,提炼了半导体生产过程中面临的核心人因工程风险;其次,从生理、认知、组织三方面将这些风险进行分类,并从相关文献中总结造成这些风险的工作任务因素、机器和系统因素、环境因素,从而提出了半导体工业生产中的人因工程风险与挑战及其影响因素模型;然后,分别对三类风险及影响因素进行了详细的文献综述分析;最终,提出了若干聚焦于国内半导体生产行业的人因工程研究方向建议,包括工作姿势培训方法、工人身体心理健康状况评估、工作地与产线布局设计、人机交互设计等,以促进我国半导体行业发展。 The semiconductor production process is complex,which requires a high degree of automation and high operation accuracy.Workers engaged in the production process face many physiological and psychological risks.Firstly,from the perspective of human factors,the core risks of human factors in the semiconductor production process were extracted based on the description of the human work during the production process.Secondly,the risks were organized into categories based on physiology,cognition,and organizational aspects.Also,the factors that caused these risks were summarized from literature on tasks,systems,and environments.Then,a model of human factors risks and challenges in semiconductor industry production and their influencing factors was proposed.Furthermore,thorough analyses from the literature review were respectively provided for each of the three categories of risks and their influencing factors.Finally,some suggestions on the research directions of human factors engineering focusing on the domestic semiconductor production industry were proposed,including work posture training methods,workers'physical and mental health assessment,workplace and production line layout design,humancomputer interaction design,etc.,in order to promote the development of China's semiconductor industry.
作者 杨敏倩 饶培伦 YANG Minqian;RAU Peilun(Department of Industrial Engineering,Tsinghua University,Beijing 100084,China)
出处 《工业工程与管理》 CSCD 北大核心 2024年第2期1-9,共9页 Industrial Engineering and Management
关键词 半导体产业 人因工程 工业工程 管理 semiconductor industry human factors industrial engineering management
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  • 1[1]LaDou J,Rohm T.The international electronics industry[J].Int J Occup Environ Heahh,1998,Jan-Mar 4(1):1~8.
  • 2[2]Polakoff PL.Despite appearances,no clean bill of health for semiconductor trade[J].Occup Health Safe,1989,Jan 58(1):14.
  • 3[3]Schenker M.Occupational lung diseases in the industrializing and industrialized world due to modern industries and modern pollutants[J].Tuber Lung Dis,1992,Feb 73(1):27 ~ 32.
  • 4[4]Abdollahzadeh S,Hammond SK,Schenker MB,A model for assessing Occupational exposure to extremely low frequency magnetic rields in fabrication rooms in the Semioonductor Health Study[J].Am J Ind Med,1995,Dec 28(6):723 ~ 734.
  • 5芯闻参考--对集成电路产业的认识和思考[R].中国电子工业科学技术交流中心,2012,7.
  • 6刘亮,蒋婷婷.遭遇景气低点,等待行业拐点--半导体行业深度报告[R].兴业证券,20081230.
  • 7IC Insights. Taiwan Residents and Chinese Companies Represented Five of Eight Fastest Growing Top-25 Fabless IC Suppliers in 2013[EB/OL]. 2014-05-07. http://www.icinsights. eom/news/bulletins/Taiwan Residents-And-Chinese-Companies- Represented-Five-Of-Eight-Fastest-Growing-Top25- Fabless-IC-Suppliers-In-2013.
  • 8Gartner Market Share Analysis: Semiconductor Packaging and Test Services, Worldwide [R]. Gartner, 2014, 4.
  • 9姚宏光.半导体封装行业研究报告[R].华泰联合证券20110331.
  • 10各公司网站及财务报告[R].

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