摘要
研究了添加适量的Co元素对Sn-0.7Cu无铅钎料合金性能的影响,应用Axio Scope A1显微镜、差示扫描量热仪、MUST system3型可焊性测试仪、高温试验箱、HITACHI 550i型扫描电镜对Sn-0.7Cu-xCo(x=0%、0.002%、0.004%、0.02%、0.03%)合金焊料进行金相观察,并对其熔点、可焊性及可靠性能进行了对比试验分析。结果表明,加入一定量Co元素,使Sn-0.7Cu熔点增高,润湿性能有所降低,但金相组织和可靠性均得到改善。
The effect of adding an appropriate amount of Co element on the properties of Sn-0.7Cu lead-free solder alloy was studied.The microstructure of Sn-0.7Cu xCo(x=0%,0.002%,0.004%,0.02%,0.03%)alloy solder was observed using Axio Scope A1 microscope,differential scanning calorimeter,FAST system 3 weldability tester,high-temperature test chamber,and HITACHI 550i scanning electron microscope,and the melting point,weldability,and reliability performance were compared and analyzed.The results showed that adding a certain amount of Co element increased the melting point of Sn-0.7Cu and reduced its wetting performance,but the metallographic structure and reliability were improved.
作者
唐丽
李润萍
黄慧兰
韩红兰
段泽平
李丽
Tang Li;Li Runping;Huang Huilan;Han Honglan;Duan Zeping;Li Li(Yunnan Tin Industry New Materials Co.,Ltd.,Kunming Yunnan 650000,China)
出处
《山西冶金》
CAS
2024年第4期17-19,共3页
Shanxi Metallurgy
关键词
焊料
金相组织
熔点
润湿性
可靠性
solder
metallographic structure
melting point
wettability
reliability