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高介电常数La_(2)O_(3)材料的制备方法及其介电性能研究进展

Research progress on preparation methods and dielectric properties of high dielectric constant La_(2)O_(3) materials
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摘要 在众多高介电常数栅介质材料中氧化镧(La_(2)O_(3))因带隙大、热稳定性良好等特点而具有代替传统SiO_(2)栅介质材料的潜力。介绍了La_(2)O_(3)薄膜的制备方法,综述了目前改善La_(2)O_(3)薄膜介电性能的方法并展望了其未来发展前景。 Among many high dielectric constant gate dielectric materials,La_(2)O_(3) possesses the characteristics of large band gap and good thermal stability,and has the potential to replace the traditional SiO_(2) gate dielectric.In this paper,the preparation methods of La_(2)O_(3) thin films were introduced,and the current approaches to improve the dielectric properties of La_(2)O_(3) films were reviewed.In the end,the future development of La_(2)O_(3) was prospected.
作者 魏小茹 陈文杰 王锋 朱胜利 Wei Xiaoru;Chen Wenjie;Wang Feng;Zhu Shengli(College of Materials Science and Engineering,Lanzhou Jiaotong University,Lanzhou 730070;College of Chemical Engineering and Materials,Quanzhou Normal University,Quanzhou 362000;College of Materials Science and Engineering,Tianjin University,Tianjin 300350;College of New materials and Footwear and Clothing Engineering,Liming Vocational University,Quanzhou 362000)
出处 《化工新型材料》 CAS CSCD 北大核心 2024年第6期33-37,共5页 New Chemical Materials
基金 福建省科技重大专项专题项目(2021HZ021027) 福建省自然科学基金(2020J01776) 省级科技创新重点项目(2021G02028)。
关键词 高介电常数介质材料 La_(2)O_(3) 电学特性 制备方法 high dielectric constant dielectric material La_(2)O_(3) electrical properties preparation methods
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  • 1朱燕艳,方泽波,刘永生.Structural and optical properties of Er_2O_3 films[J].Journal of Rare Earths,2010,28(5):752-755. 被引量:1
  • 2Dalapati G K, Chatterjee S, Samanta S K, et al. Electrical characterization of low temperature deposited TiOz films on strained SiGe layers. Appl Surf Sei, 2003, 210(324): 249.
  • 3Qi Wenjie, Nish R, Dharmarajan E, et al. Uhrathin zirconium silicate thin film with good thermal stability for alternative gate dielectric application. Appl Phys Lett,2000, 77(11) :1704.
  • 4Harris H, Choi K, Mehta N, et al. HfO2 gate dielectric with 0. 5 nm equivalent oxide thickness. Appl Phys Lett,2002, 81(6): 1065.
  • 5Gusev E P, Copel M, Cartier E. High-resolution depth profiling in ultrathin A12O3 films on Si. Appl Phys Lett,2000, 76(2) : 176.
  • 6Chin A, Liao C C, Liu C H, et al. Device and reliability of high K Al2O3 gate dielectric with good mobility and low Dit,Techn Dig VLSI Symp, 1999, 135.
  • 7James Kolodzey. Electrical conduction and dielectric breakdown in aluminum oxide insulators on silicon. IEEE Trans Electron Devices,2000, 47(1):121.
  • 8Shao Q Y, I.i A D, Ling H Q , et al. Growth and characterization of Al2O3 gate dielectric films by low-pressure metal organic chemical vapor deposition. Microelectric Eng,2003, 66 (1-4): 842.
  • 9Kwo J, Hong M, Kortan A R, et al. Properties of high K gate dielectrics Gd2O3 and Y2 O3 for silicon. J Appl Phys,2001, 89(7):3920.
  • 10Wu Y H, Yang M Y, Chin A , et al. Electrical characteristics of high quality La2O3 gate dielectric with equivalent oxide thickness of 5 angstrom. IEEE Elec Dev Lett, 2000, 21(7) : 341.

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