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基于惠更斯等效原理的高速高密度PCB分级建模方法

Segmentation Modelling Method for High-Speed High-Density PCB Systems Based on Huygens Equivalent Principle
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摘要 当带宽达到20 GHz以上时(波长从15 mm到无穷小),高速高密度电子系统的内部电路电磁环境变得十分复杂,越来越难以建模和分析预测,进一步当带宽达到40 GHz以上时,电路电磁环境问题将变得更加尖锐.为在设计阶段能够对电磁作用过程、作用效应进行预测评估及控制,需要精确的建模方法和针对大尺度问题的快速计算技术,尤其是超大带宽超高速混合电路和集成电路.本文提出了基于混合电路环境电磁计算基础理论的跨尺度处理技术,通过惠更斯等效原理和电磁奇异性几何结构的电磁收敛降速机理的利用,解决了多维交叉多尺度电路电磁环境场路融合的高效率高精度建模技术挑战;利用惠更斯等效原理和基尔霍夫积分方程,在区域边界面上定义了惠更斯端口,提出了对于任意复杂印制电路板(Printed Circuit Board,PCB)同时垂直方向和水平方向区域分解的一般方法,实现了任意PCB结构的分级分类处理和模块化封装,提高了高速高密度电子系统分析的灵活度;提出了基于几何结构电磁学多重本地本征展开的技术途径,发展了基于模式和区域分解分割的快速并行处理技术,通过电磁锐变区域本征描述及场分布的本征基函数表征,实现了高精度和高计算速度兼得,减少了复杂电子系统的计算时间和设计时间.统计数据表明,本文提出的方法在0~40 GHz大带宽频率范围内频偏误差为3.7%、幅度偏差为±3 dB.本文提出的PCB分级建模分析方法可以应用于高端电子通信系统设计,提升我国宽带高速数模系统的高效电路设计和环境电磁调控能力,缩短产品研发周期. When the working bandwidth exceeds 20 GHz(wavelength from less than 15 mm to infinitesimal),the electromagnetic(EM)environment of high-speed high-density electronic systems becomes very complex,and it is increas⁃ingly difficult to model,analyze and predict the EM response,and it makes the problem more acute when the bandwidth reaches more than 40 GHz.In order to be able to predict,evaluate and even control the process and effect of EM re⁃sponse at the design stage,accurate modeling methods and large-scale fast computing techniques are required,especially ultra-large bandwidth ultra-high-speed hybrid circuits and integrated circuits are involved.In this paper,a multi-scale pro⁃cessing technology based on the basic theory of electromagnetic computing in hybrid circuit environment is proposed,which solves the technical challenge of high-efficiency and high-precision field-circuit-hybrid modeling for electromagnet⁃ic environments of multi-scale complex circuits by employing the Huygens equivalence principle and the electromagnetic convergence and speed reduction mechanism of electromagnetic singularity.Using the Huygens equivalence principle and Kirchhoff integral equation,the Huygens port is defined on the regional boundary surface,and a general method of domain decomposition is proposed which can simultaneously cut entire region into vertical and horizontal subregions for arbitrary complex printed circuit board(PCB).The proposed realizes the hierarchical classification processing and modu⁃lar packaging of any PCB structure,and improves the flexibility of high-speed high-density electronic system analysis.A technical approach based on eigen mode expansion method is proposed,and a fast parallel processing technology based on modal and domain decomposition and segmentation method is developed,which realizes both high precision and high calculation speed through the eigen-function representation for discontinuous field distribution,and reduces the calculation time and design time of complex electronic systems.Statistic data reveal frequency error of 3.7%and ampli⁃tude error of±3 dB in verification range of 0~40 GHz.The hierarchical modeling and analysis method proposed in this paper can be applied to the design of high-end electronic communication system and improve the Chinese circuit design and control capabilities of the electromagnetic environment of broadband high-speed digital-analog system,and shorten the product development cycle.
作者 刘元安 高兆栋 孙胜 苏明 郑少勇 吴帆 郭星月 穆冬梅 LIU Yuan-an;GAO Zhao-dong;SUN Sheng;SU Ming;ZHENG Shao-yong;WU Fan;GUO Xing-yue;MU Dong-mei(Beijing Key Laboratory of Work Safety Intelligent Monitoring,School of Electronic Engineering,Beijing University of Posts and Telecommunications,Beijing 100876,China;School of Electronic Science and Engineering,University of Electronic Science and Technology of China,Chengdu,Sichuan 611731,China;School of Electronic and Information Engineering(School of Microelectronics),Sun Yat-sen University,Guangzhou,Guangdong 510006,China)
出处 《电子学报》 EI CAS CSCD 北大核心 2024年第4期1118-1131,共14页 Acta Electronica Sinica
基金 国家自然科学基金(No.62090015,No.62293494,No.62301071)。
关键词 等效原理 本征模式展开 电路建模 区域分解 信号完整性 集成电路 芯片封装 equivalent principle eigenmode expansion circuit modelling domain decomposition signal integrity integrated circuit package
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