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铀部件表面复合镀层的界面力学行为研究

RESEARCH ON INTERFACE MECHANICAL BEHAVIOR OF COMPOSITE COATINGS ON SURFACE OF URANIUM COMPONENTS
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摘要 针对铀部件表面复合镀层界面结合强度较低,甚至出现局部脱落或开裂问题,在磁控溅射沉积工艺下复合镀层界面特性研究的基础上,建立了镀层界面力学行为研究的数值模型,研究了沉积温度、镀层材料性能,以及构件尺寸等对Al/Ti、Al/Al_(2)O_(3)复合镀层界面力学行为的影响。结果表明,沉积温度超过300℃时,外镀层界面会出现较大的应力波动,会直接影响到复合镀层的界面结合强度。因此,Al/Ti、Al/Al_(2)O_(3)复合镀层的沉积温度应不超过300℃。与复合镀层Al/Ti相比较,复合镀层Al/Al_(2)O_(3)不仅能够提高Al镀层和基体界面的结合力,还能够降低界面处的应力波动,将是进一步改善铀及铀合金耐蚀性和耐磨性的主要研究方向。 Aiming at the problem of low interfacial combination strength or even cracking properties of composite coatings on uranium surface,based on the research of interface characteristics of composite coatings,the numerical model was established to study the interface mechanical behavior of coating interface,and effects of deposition temperature,coating material and component size on interfacial mechanical behavior of Al/Ti、Al/Al_(2)O_(3) composite coatings were discussed.The results indicate that the stress⁃oscillation behavior occur at the interface of out coating when the deposition temperature exceeds 300℃,and which will directly affect the interfacial bonding strength of the composite coatings.Therefore,the deposition temperature of Al/Ti、Al/Al_(2)O_(3) composite coatings must not exceed 300℃during magnetron sputtering deposition process.Compared with Al/Ti composite coatings,Al/Al_(2)O_(3) composite coatings can not only improve the adhesion of Al coating and uranium substrate,but also reduce the stress⁃oscillation at the interface,which will be the main research directions to further improve the corrosion resistance and wear resistance of uranium and uranium alloys.
作者 史平安 王天忠 SHI PingAn;WANG TianZhong(Institute of Systems Engineering,China Academy of Engineering Physics,Mianyang 621999,China;Shock and Vibration of Engineering Materials and Structures Key Laboratory of Sichuan Province,Mianyang 621999,China)
出处 《机械强度》 CAS CSCD 北大核心 2024年第3期728-735,共8页 Journal of Mechanical Strength
基金 国家自然科学基金项目(U153029,11372295,11972219)资助。
关键词 铀部件 复合镀层 沉积温度 界面应力 Uranium component Composite coating Deposition temperature Interfacial stress
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