酚酞聚芳醚腈酮/氮化硼导热复合材料的制备与性能

Preparation and properties of phenolphthalein poly(aryl ether nitrile ketone)/boron nitride thermal conductive composite materials

以酚酞基聚芳醚腈酮(PEK-CN)为基体树脂,氮化硼(BN)为导热填料,采用粉末共混法和高温模压法制备了PEK-CN/BN导热复合材料,探究了BN粒径大小及粒径复配对PEK-CN/BN复合材料导热性能和热力学性能的影响。BN的添加能有效提升PEK-CN/BN复合材料的导热性能,当BN质量分数为30%时,复合材料的导热系数随BN粒径的增大呈现先减小后增大的趋势。当BN粒径为20μm时,导热系数达到最大值0.708 W/(m·K),较纯PEK-CN提高约83.3%。将粒径为10和2.6μm的BN按照质量配比3∶2制备的复合材料,其导热系数的最大值为0.961 W/(m·K),是纯PEK-CN导热系数的3.83倍,复合材料的导热性能得到显著增强。

PEK-CN/BN thermal conductive composites were prepared by powder blending and high temperature molding methods using phenolphthalein poly(aryl ether nitrile ketone)(PEK-CN)as matrix resin and boron nitride(BN)as thermal conductive filler.The effects of BN particle size on the thermal conductivity and thermodynamic properties of PEK-CN/BN composites were investigated.The results showed that the addition of BN could effectively improve the thermal conductivity of PEK-CN/BN composites.The thermal conductivity of the composites firstly decreased and then increased with increasing the BN particle size with 30%mass fraction of BN.With 20μm particle size of BN,the thermal conductivity was highest to 0.708 W/(m·K),which was 83.3%higher than that of pure PEK-CN.The maximum thermal conductivity of the composite,prepared with 3∶2 mass ratio of BN with particle size of 10 and 2.6μm,was 0.961 W/(m·K),which was 3.83 times that of pure PEK-CN,suggesting the thermal conductivity of the composite was significantly enhanced.