期刊文献+

关于电子元器件失效分析方法的讨论

Analysis on Failure Analysis Methods for Electronic Components
下载PDF
导出
摘要 电子元器件的失效分析是一个复杂而重要的任务。通过综合运用各种分析方法,我们可以更全面地了解元器件的失效原因,为后续的改进和优化提供有力的支持。同时,随着技术的不断进步,我们有望在未来开发出更加先进和高效的失效分析方法,为电子行业的发展做出更大的贡献。本文基于工作实践,通过对电子元器件失效的剖析,给出了一种电子元器件失效分析的方法和流程,供相关技术人员参考。 Failure analysis of electronic components is a complex and important task.Through the comprehensive use of various analysis methods,we can understand the causes of component failure more comprehensively,and provide strong support for subsequent improvement and optimization.At the same time,with the continuous advancement of technology,we are expected to develop more advanced and efficient failure analysis methods in the future,and make greater contributions to the development of the electronics industry.Based on the work practice,this paper gives a method and process for the failure analysis of electronic components through the analysis of electronic component failure,which is for the reference of relevant technicians.
作者 田磊
出处 《日用电器》 2024年第5期126-129,142,共5页 ELECTRICAL APPLIANCES
关键词 失效分析 芯片失效 自动测试设备 failure analysis chip failure automatic test equipment
  • 相关文献

参考文献4

二级参考文献9

  • 1Liou J J.Electrostatic discharge (ESD): A spoiler to development of next-generation technologies[C]//Proc. 2010 IEEE International Conference of Electron Devices and Solid-State Circuits (EDSSC),Hong Kong, 2010:1-3.
  • 2Pan Z H,Hollad S,Schroeder D,et al.Understanding the mechanisms of degradation and failure observed in ESD protection devices under system-level tests[J].IEEE Trans. on Device and Materials Reliability,2010,10(2):187-191.
  • 3ANSI/ESD STM5.1-2007, ESD Association Standard Test Method for Electrostatic Discharge Sensitivity Testing-Human Body Model (HBM) Component Level[S].
  • 4张滨海,方培源,王家楫.红外发光显微镜EMMI及其在集成电路失效分析中的应用[C]//第五次华北五省市电子显微学研讨会及第六届实验室协作服务交流会论文集,2008:25-32.
  • 5Voldman S H.Electrostatic discharge (ESD) and technology scaling: the future of ESD protection in advanced technology[C]//Proc. 9th International Conference on Solid-Stateand Integrated-Circuit Technology,2008:325-328.
  • 6付鸣.半导体器件失效分析与检测[J].仪表技术与传感器,1997(12):35-38. 被引量:7
  • 7袁琰红,陈力,王英杰,高立明.基于ESD的芯片失效分析[J].半导体光电,2012,33(3):397-400. 被引量:9
  • 8关本霞.半导体器件失效分析与检测[J].科技创新与应用,2013,3(36):42-42. 被引量:1
  • 9陈雷,宋耕,肖刚,佘丽,王志刚,张武平,胡毅.400 Gbit/s PAM4 CFP8光收发模块技术研究[J].光通信研究,2018(2):60-63. 被引量:5

共引文献15

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部