高热容量PCB波峰焊工艺研究

Research on Wave Soldering Technology for High Thermal Capacity PCB

超级电容PCB采用多层的大面积敷铜,且板厚3 mm设计。由于其高热容量的属性,在波峰焊接过程中,由于热输入不够,给制造工艺带来了新的挑战,会存在透锡不足和焊接不良等问题。然而,超级电容板是汽车产品充放电系统的重要组件,需要较高的透锡率和焊点质量满足其产品的可靠性。主要采用正交试验设计方法研究波峰焊工艺参数对焊点质量的影响规律,获得了焊接工艺参数影响焊点质量的主次顺序。经过工艺试验验证,解决了焊接难点,对波峰焊接工艺具有一定的参考价值和帮助。

The supercapacitor PCB is designed with multi-layer large area integration copper and a plate thickness of 3 mm.Due to its high heat capacity property,during the wave solding process,due to insufficient heat input,it brings new challenges to the manufacturing process,and there will be problems such as insufficient tin penetration and poor welding.However,the supercapacitor board is an important component of the charge-discharge system of automotive products,which requires high tin penetration rate and solder joint quality to meet the product reliability.The orthogonal experimental design method is adopted to study the influence of wave soldering process parameters on the quality of solder joints,and the primary and secondary order of the influence of welding process parameters on solder joint quality are obtained.After process testing and verification,the welding difficulties are solved,which has certain reference value and assistance for the wave soldering process.