DC-DC变换器热分析及热力耦合仿真分析

Thermal Analysis and Thermal Bechanical Coupling Simulation Analysis of DC-DC Converter

随着大功率模块型DC-DC变换器使用环境日趋恶劣,其高度集成的功率元件和IC芯片的热流密度增加,变换器元器件可靠性要求提高。其中DC-DC变换器电路可靠性的重要影响因素之一是温度。高、低温及其循环会对元器件的失效产生严重的影响,从而造成变换器的失效。通过热分析优化变换器的空间布局,开发导热胶灌封工艺,可以提高其散热能力。首先,以传热学理论为基础,利用有限元热仿真软件分析其三维温度场,并建立热力耦合仿真模型,进行热力耦合仿真分析;其次,根据模拟仿真结果,给模块产品设计提供了可靠的热分析、热设计数据;最后,研制试验样件并进行测试,验证所进行的设计的合理性。

As the usage environment of high-power modular DC-DC converters becomes increasingly harsh,its highly integrated power components and IC chip heat flux density increase,and the reliability requirements for converter components also increase.One of the important factors affecting the reliability of DC-DC converter circuits is temperature.High and low temperatures and their cycling can have a serious impact on the failure of components,which can lead to the failure of converters.The heat dissipation capacity of the converter can be improved by optimizing the space layout of the converter through thermal analysis and developing the thermal glue potting process.Firstly,based on the theory of heat transfer,the three-dimensional temperature field is analyzed by the finite element thermal simulation software,and the thermodynamic coupling simulation is carried out by establishing the thermodynamic coupling simulation model.Secondly,based on the simulation results,reliable thermal analysis and thermal design data are provided for module product design.Finally,the test samples are developed and tested to verify the rationality of the design.