2.5D TSV转接板无损检测方法的研究

Research on Non-Destructive Inspection Method of 2.5D TSV Interposers

利用以硅通孔(TSV)为核心技术的硅转接板封装3D集成电路,可以有效缩短器件的互连长度。TSV转接板在微电子领域被广泛应用,但对其工艺制备过程中的检测技术研究相对较少。TSV转接板的检测对评估其良率与应用可靠性至关重要。因此,总结了7种非破坏性检测技术,探讨了无损检测技术的基本原理和优缺点,形成了1种系统的2.5D TSV转接板无损检测的评价方法。该方法不仅为2.5D微模组产品的研制与开发提供了支撑,还满足了3D封装的典型应用需求。

Using silicon through via(TSV)as the core technology to package 3D integrated circuits with silicon interposers can effectively shorten the interconnection length of devices.TSV interposers are widely used in microelectronics,but relatively little research has been done on inspection technology during their process preparation.The inspection of TSV interposers is critical for evaluating their yield rate and application reliability.Therefore,seven non-destructive inspection technologies are summarized,the basic principles,advantages and disadvantages of the non-destructive inspection technologies are discussed,and a systematic evaluation method for non-destructive inspection of 2.5D TSV interposers is formed.The method not only provides support for the research and development of 2.5D micro-module products,but also meets the typical application requirements of 3D package.