期刊文献+

纳米墨水闪灯烧结的应用及工艺优化研究现状

Research Status of Application and Process Optimization of Intense Pulsed Light Sintering of Nanoparticle-ink
下载PDF
导出
摘要 闪灯烧结技术,又称光子烧结技术,因具有快速、选择性、非接触、易与卷对卷装置集成等特点而受到广泛关注。对纳米墨水闪灯烧结技术在印刷电子、太阳能电池、增材制造、功能器件制备等领域的应用和研究现状进行了综述。介绍了在纳米墨水闪灯烧结中,烧结所得薄膜容易产生鼓包、裂纹、脱粘、翘曲等失效的现象及原因。介绍了两步闪灯烧结法、多次脉冲闪灯烧结法及多次循环闪灯烧结法这3种有效的工艺优化方法及应用。提出亟需机理性的基础研究,以理性指导闪灯烧结工艺优化。 Intense pulsed light(IPL)sintering technology or flash light sintering,has attracted extensive attention due to its advantages of fast,selective,non-contact and easily integrated with roll-to-roll equipment.The application and research status of IPL sintering nanoparticle-ink in the fields of printed electronics,solar cells,additive manufacturing and functional device fabrication were reviewed.The failure phenomenon such as bulging,cracks,debonding and warpage of the sintered films during IPL sintering and its reasons for failures were introduced.Three types of effective process optimizing methods named two-step flash light sintering,multi-pulsed flash light sintering and multi-cycle intense pulsed light sintering and their application were introduced.It was proposed that the basic mechanistic research was urgently needed,which can theoretically guide the optimization of IPL sintering process.
作者 母全祎 李鑫 MU Quanyi;LI Xin(School of Physics and Electronic-Electrical Engineering,Ningxia University,Yinchuan 750021,China)
出处 《热加工工艺》 北大核心 2024年第8期6-10,共5页 Hot Working Technology
基金 宁夏回族自治区重点研发计划项目(2021BEE03008,2019BE B04025) 宁夏自然科学基金项目(2021AAC03101)。
关键词 闪灯烧结 纳米墨水 失效 工艺优化 印刷电子 intense pulsed light sintering nanoparticle-ink failure process optimization printed electronics
  • 相关文献

参考文献3

二级参考文献49

  • 1简家文,杨邦朝,张益灿.Pt/YSZ电极结构形貌对传感器特性的影响[J].电子测量与仪器学报,2004,18(4):10-14. 被引量:6
  • 2Kim C,Nogi M,Suganuma K.Electrical conductivity en-hancement in inkier-printed narrow lines through gradual heating[J].Journal of Micromechanics and Microenginee-ring,2012,22(3):5.
  • 3Jeong S,Song H C,Lee W W,Choi Y,Ryu B H.Prepara-tion of aqueous Ag Ink with long-term dispersion stability and its inkjet printing for fabricating conductive tracks on a polyimide film[J].Journal of Applied Physics,2010,108(10):5.
  • 4Allen M,Alastalo A,Suhonen M,Mattila T,Leppaniemi J,Seppa H.Contaetless electrical sintering of silver nano-particles on flexible substrates[J].IEEE Transactions on Microzoave Theory and Techniques,2011,59(5):1419-1429.
  • 5Perelaer J,Jani R,Grouchko M,Kamyshny A,Magdassi S,Schubert U S.Plasma and microwave flash sintering of a tailored silver nanopartiele ink,yielding 60% bulk eonduc-tivity on cost-effective polymer foils[J].Advanced Mate-rials,2012,24(29):3993-3998.
  • 6Reinhold I,Hendriks C E,Eekardt R,Kranenburg J M,Perelaer J,Baumann R R,Schubert U S.Argon plasma sintering of inkjet printed silver tracks on polymer sub-strates [J].Journal of Materials Chemistry,2009,19(21):3384-3388.
  • 7Buffat P,Borel J P.Size effect on melting temperature of gold particles[J].Physical Review A,1976,13(6):2287-2298.
  • 8Shyjumon I,Gopinadhan M,Ivanova O,Quaasz M,Wulff H,Helm C A,Hippler R.Structural deformation,melting point and lattice parameter studies of size selected silver clusters[J].European Physical Journal D,2006,37(3):409-415.
  • 9Bohren C F,Huffman D R.Absorption and Scattering of Light by Small Particles[M].New York:Wiley.1983.
  • 10Lesyuk R,Jillek W,Bobitski Y,Kotlyarchuk B.Low-energy pulsed laser treatment of silver nanoparticles for intercon-nects fabrication by ink-jet method[J].MicroelectronicEn-gineering,2011,88(3):318-321.

共引文献9

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部