退火温度对键合金带微观组织与综合性能的影响

Effects of Annealing Temperature on Microstructure and Comprehensive Properties of Bonding Gold Ribbon

采用聚焦离子束(FIB)、扫描电镜(SEM)、力学和电学性能试验设备等测试手段,研究了不同退火温度对金带组织结构、力学性能和电学性能的影响。结果表明:金带加工态组织由沿轧向伸长的{001}~{110}<111>取向变形晶粒组成,300℃退火时,金带发生再结晶,形成{001}~{110}<001>再结晶晶粒。温度升至500℃时,再结晶完成,晶粒以Cube取向({100}<001>)为主导。随退火温度增加,金带的抗拉强度减小,伸长率和导电率增加。退火温度超过200℃后,金带抗拉强度显著减小,而温度超过400℃后,伸长率显著增加。金带的导电率在250℃和400℃出现两次明显增加,归因于金带发生了明显回复和再结晶,点缺陷和位错大幅度减少,导致导电率显著增加。

The effects of different annealing temperatures on the microstructure,mechanical properties and electrical properties of the gold ribbon were investigated by focused ion beam(FIB),scanning electron microscope(SEM),mechanical and electrical properties test equipment.The results show that deformed microstructure of the gold ribbon generates elongated grains with{001}~{110}<111>orientation along the rolling direction.Gold ribbon nucleates and generates{001}~{110}<001>texture annealed at 300℃,and the strong cube({100}<001>)orientation forms at just complete recrystallization when annealing temperature rises to 500℃.The tensile strength of gold ribbon decreases,while elongation and conductivity increase with the increase of annealing temperature.The tensile strength and the elongation of gold ribbon change significantly annealed above 200℃and 400℃,respectively.The conductivity of gold ribbon increases significantly annealed at 250℃and 400℃,which is due to the obvious recovery and recrystallization,thus the number of point defects and dislocations significantly decreases,resulting in the significant increase of the conductivity.