带OCP连接器端的PCB板厚改善研究

Research on plate thickness improvement of PCB with OCP connector

开放计算项目(OCP)连接器是一种开放式的服务器架构,是用于服务器功能扩充的便捷、高效、快速安装的连接方案。OCP连接器有过大电流和较高的插拔可靠性要求,在印制电路板(PCB)制作端表现为较高的板厚监控要求。OCP连接器在图形设计上位于服务器板边,常表现为板厚偏薄。从PCB制作的角度出发,剖析了OCP连接器与PCB单元板厚设计差异和失效模式,提出了含有OCP连接器设计的PCB板在叠构设计方面的偏公差设计方法;在制作方面定义了OCP连接器对应废料区铺铜设计,以及在连接器内部保证屏蔽结构的前提下的图形优化设计方法。

Open compute project(OCP)is an open server architecture used for server architecture expansion.The function of OCP connectors puts forward their requirements for excessive overcurrent and high insertion and removal reliability.On the printed circuit board(PCB)end,the OCP module has a higher requirement for board thickness.The OCP connector has a substrate area design similar to a gold finger connector on the server board edge,which often manifests as being thin.This article analyzes the differences in thickness design between OCP connectors and PCB unit boards and failure modes from the perspective of PCB manufacturing.The deviation tolerance design method is pointed out for PCB boards containing OCP connector design in terms of stacking design.In terms of production,the copper laying design is defined for the waste area of OCP connectors,as well as the graphic optimization design method for ensuring the shielding structure inside the connectors.