化学镀镍/钯/金工艺中连接盘设计对金厚影响的研究

Research on the influence of connecting pad design on gold thickness in ENEPIG process

通过设计几种常见的连接盘,在化学镀镍/钯/金(置换金体系)后量测连接盘的金层厚度,以研究连接盘对置换金厚的影响。对实验结果进行分析,发现在相同的加工条件下,连接盘的沉金厚度有随着连接盘面积增大而减小的趋势;当连接盘面积小于一定量时,阻焊限定(SMD)连接盘的金厚较相同大小的非阻焊限定(NSMD)连接盘的金厚降低;对于设计大小相同的连接盘,连接盘的金厚与其连接的沉金连接盘或铜面的面积大小呈负相关。

This article studies the effect of connecting pad design on the gold thickness of the replacement gold system by designing several common immersion gold connecting pads and measuring the gold thickness of the connecting pads after electroless nickel electroless palladium immersion gold(ENEPIG)(replacement gold system).After analyzing the experimental results,it is found that under the same processing conditions,the thickness of the gold-plated connecting pad decreased with the increase of the gold-plated connecting pad area.When the area of the connecting pad is smaller than a certain value,the gold thickness of the solder mask defined(SMD)connecting pad decreases compared with that of the non solder mask defined(NSMD)connecting pad.For connecting pads of the same design and size,there is a negative correlation between the gold thickness of the connecting pad and the area of the connected immersio gold connecting pad or copper surface.