PCB板厚检测方法与应用

The method and application of PCB thickness detection

在印制电路板(PCB)制程中,为解决板厚对安装、加工及信号传输等多方面造成的影响,从人工到自动化检测,通过不同的检测机构,采用接触式光栅尺和非接触式激光及光谱共焦的原理,来完成不同制程的厚度检测工作。通过不同制程采用的各种机械结构和测量传感器,最终满足了压合制程、背钻制程及成品制程的不同需求。经过验证,测量数据稳定,效率更高,测量更加便捷,为PCB后制程的加工提供了更加准确的数据作为依据,可让产品质量得到更好的保障。

In the printed circuit board(PCB)process,it is necessary to handle with the influence of plate thickness on installation caused by plate thickness,the impact of production,signal transmission,and other aspects.Thickness detection is conducted for different processes with detection means from manual to automatic detection,using different detection machanisms.Contact measurement whit grating ruler and non-contact measurement using laser and spectral confocal principle are performed.For different processes,different mechanical structures and measurement sensors are used.Finally different requirements of the pressing process,the back drilling process,and the finished product manufacturing process are met.Verification results show that the measurement date are stable,and the measurement has higher efficiency and convenience.This provides more accurate data for the production of PCBs in the subsequent process,so that the product quality can be better guaranteed.