一种纳秒级半导体激光器集成微模块

A Nanosecond Semiconductor Laser Integrated Micromodule

为提升半导体激光器在高重频下工作的稳定性,并满足模块高集成度的需求,研制了一款纳秒级半导体激光器集成微模块。该微模块包括半导体激光器芯片、装载激光器芯片的基板以及驱动电路。在基板侧面设计金属化过孔,将半导体激光器芯片的电极从基板侧面引出,实现了激光的垂直发射;采用球栅阵列(BGA)封装GaN HEMT和GaN驱动器,优化电路布局和半导体激光器的回流路径,减小寄生电感,实现了1 ns的发光脉冲宽度,工作重频达到了1 MHz;同时,发光脉冲信号的前沿抖动度小于60 ps,脉冲宽度抖动度小于200 ps,表明其具有较高的稳定性。最后,采用高透明、耐高温的灌封胶对该微模块实现集成化封装,整体尺寸仅为6mm×5mm×2.6mm。

In order to improve the stability of semiconductor laser operating at high repetition frequency and meet the requirements for high integration of the module,a nanosecond semiconductor laser integrated micromodule was developed.The micromodule includes a semiconductor laser chip,a board for loading the laser chip and a driving circuit.By designing metalized vias on the side of the board,the elec-trodes of the semiconductor laser chip were drawn out from the side of the board,achieving vertical emis-sion of the laser.By using ball grid array(BGA)packaged GaN HEMT and GaN driver,the layout and reflux path of the semiconductor laser were optimized,parasitic inductance was reduced and 1 ns light pulse width was achieved with a working repetition frequency of 1 MHz.Meanwhile,the front edge jitter of the light pulse signal is less than 60 ps,and the pulse width jitter is less than 200 ps,indicating high stability of the micromodule.Finally,the micromodule is integrated and packaged using highly transparent and high-temperature resistant sealing adhesive,and the overall size is only 6mm×5mm×2.6mm.