蚀刻通孔的阻值影响因素以及调整方法分析

Analysis of the Key Influence Factor and Adjustment of Contact Etch Resistance in CT-ET Process

阐述通孔的尺寸、形貌以及底部的特性是决定通孔阻值的关键因素,不同的蚀刻步骤需要配合不同的蚀刻气体,功率以及蚀刻时间。为此,从通孔蚀刻不同的步骤对尺寸、形貌,底部的特性的影响着手,分析影响通孔阻值的关键因素,找出通孔蚀刻工艺的管控方案,扩大工艺窗口。

This paper describes that the size,profile and the bottom feature is the key influence factor of the contact hole's resistance.Different contact etch layer's etch gas and power is different.It studies the different etch step how to affect the CT hole size/profile/the bottom feature,to find the key influence factor to affect CTRC.So it defines the control table of this layer,to enlarge the process window.