塑封器件使用风险与应对措施分析

Analysis of Risk and Countermeasures for the Use of Plastic Encapsulated Microcircuits

阐述塑封器件使用中的风险,包括温度适应性、潮气入侵、塑封器件分层、高可靠领域使用商用塑封器件。从器件选用和保证、可靠性评估保证措施方面,提出塑封器件使用的应对措施。

This paper describes the risks in the use of plastic packaging devices,including temperature adaptability,moisture intrusion,delamination of plastic packaging devices,and the use of commercial plastic packaging devices in highly reliable fields.It proposes countermeasures for the use of plastic sealed devices from the aspects of device selection and assurance,reliability evaluation and assurance measures.