石墨烯填充导热硅凝胶的研究进展

Research progress of graphene filled thermal conductive silica gel

综述了石墨烯在导热硅凝胶领域的应用及研究进展,介绍了石墨烯复合硅凝胶的导热机理,分析总结了石墨烯的尺寸及层数、填充量、共价键改性、非共价键修饰以及结构设计对石墨烯基导热硅凝胶的影响,展望了石墨烯基导热硅凝胶的应用前景,并为下一步的研究开发提供思路。

The application and research progress of graphene in the field of thermal conductive silica gel are reviewed.The heat conducting mechanism of graphene compounded silica gel is introduced.In addition,the impacts of the size,layer number,filling amount,covalent bond modification,non-covalent bond modification and structural design of graphene on graphene compounded thermal conductive silica gel filled are analyzed and summarized.Finally,the application prospect of graphene filled thermal conductive silica gel is predicted,and the ideas for the research and development in the future are provided.