聚酰亚胺薄膜与碳网格共固化基板成型工艺研究

Study on Forming Process of Polyimide Film Carbon Grid Co-cured Substrate

为满足未来深空探测对航天器太阳翼基板更高的耐温性需求,提出一种新型的太阳翼基板成型工艺方法:聚酰亚胺薄膜与碳网格面板共固化成型。重点研究了聚酰亚胺薄膜与网格面板的剥离性能、网格面板的拉伸性能、蜂窝夹层结构的弯曲性能、共固化基板的耐温性能,并与J-133胶粘贴聚酰亚胺薄膜的传统工艺进行对比。结果表明,共固化工艺的聚酰亚胺薄膜剥离强度约为传统工艺的2倍,且在140℃下的各项力学性能保持率均大于87%,具有很好的耐温性;共固化基板在经历-100~140℃热真空试验后,外观质量及各项性能均合格,满足太阳翼基板耐140℃及以下空间环境的使用需求。

In order to meet the higher temperature resistance requirements of spacecraft solar wing substrate for future deep space exploration,this paper introduced a new forming process of solar wing substrate:co-curing of polyimide film and carbon grid panel.The study focused on the stripping performance of the polyimide film and the grid panel,the tensile performance of the grid panel,the bending performance of the honeycomb sandwich structure,and the temperature resistance of the co-cured substrate was made comparison of performance of samples by traditional process of using J-133 adhesive to bond polyimide film.The results showed that the peel strength of the co-curing polyimide film was about twice that of the traditional process,and the mechanical properties of the film were more than 87%at 140℃,showing good temperature resistance.After the thermal vacuum test from-100℃to 140℃,the appearance quality and various properties of the co-cured substrate passed qualification,which met the needs of the solar wing substrate to withstand the space environment of 140℃ and below.