单管IGBT产品的热设计优化

Thermal Design Optimization of Single Tube IGBT Products

本文针对单管IGBT产品的散热优化设计问题,利用Icepak进行数值模拟分析,探究了2种影响因素对单管IGBT散热的影响,可以为相关工程人员提供设计参考。结果表明:导热系数大小对单管表面温度影响非常大,导热系数分别是1、5和7W/(mK)时,单管表面温度从155.7℃降低至99.4℃及94.9℃,结合成本考虑,推荐选用导热系数为5W/(mK)比较合适。导热垫厚度为0.5、1和1.5mm时,单管表面温度分别为96.2、109和119.9℃,导热垫厚度对单管表面温度影响比较大。所以,在满足压缩量要求和装配公差时,导热垫厚度选用越薄越好。实际产品应用中,要根据产品尺寸、成本要求、性能指标综合选择最优的散热方案。

Aiming at the problem of heat dissipation optimization design of single tube IGBT products,this paper uses Icepak to conduct numerical simulation analysis,and explores the influence of two influencing factors on the heat dissipation of single tube IGBT products,which can provide design reference for related engineers.The results show that:When the thermal conductivity is 1,5 and 7W/(m K)respectively,the surface temperature of the single tube is reduced from 155.7°C to 99.4°C and 94.9°℃.Considering the cost,it is recommended to choose a thermal conductivity of 5 W/(m K).When the thickness of the thermal pad is 0.5,1 and 1.5mm,the surface temperature of the single tube is 96.2,109 and 119.9C,respectively,and the thickness of the thermal pad has a great influence on the surface temperature of the single tube.Therefore,when meeting the compression requirements and assembly tolerances,the thinner the thickness of the thermal conductivity pad is,the better.In the actual product application,the optimal cooling scheme should be selected according to the product size,cost requirements and performance indicators.