真空二流体技术制备高精细线路的研究

The role of vacuum dual-fluid technology in fabricating high-precision circuits via subtractive processes

为满足日益精细化和复杂化的印制电路板(PCB)产品需求,真空二流体技术作为新型蚀刻技术在减成法工艺中得到越来越广泛的应用。探索利用减成法工艺结合真空二流体技术制备不同铜厚的高精细线路。研究结果显示,使用18μm、25μm及35μm铜箔分别制备线宽线距为30/30μm、35/35μm和40/40μm的精细线路时,真空二流体技术提高了线宽过程能力指数(Cpk),对横向线路的改善效果最为显著,且随着铜箔厚度的减小,蚀刻因子的增大也更为明显。

To address the escalating demands for increasingly intricate and nuanced printed circuit board(PCB)products,vacuum dual-fluid technology has emerged as a pivotal etching methodology within subtractive processes.This research endeavors to investigate the synthesis of high⁃precision circuits with varying copper thicknesses through the amalgamation of subtractive processes with vacuum dual-fluid technology.Findings illustrate that fine circuits with line widths/spacings of 30/30μm,35/35μm,and 40/40μm can be fabricated using 18μm,25μm,and 35μm copper foils,respectively.Vacuum dual-fluid technology enhances the process capability index(Cpk)of the line width,with the most significant improvement observed in the Cpk of horizontal lines.Additionally,as the thickness of copper foil decreases,the increase in etching factor becomes more pronounced.