摘要
实心焊丝的镀铜层质量影响焊丝的焊接性能。镀铜层厚度和镀铜附着性是镀铜层重要的质量特性。化学镀铜镀层薄,镀铜均匀、致密,容易获得优良的镀铜附着性。如果要获得较厚的镀铜层,含钛焊丝不适合采用化学镀铜。电镀铜虽然可以保证镀铜层厚度,但因其伴有微小程度的化学置换反应,对镀铜附着性会产生不良影响。为了抑制化学置换反应,可以在电镀铜前镀上薄薄的铜层,从理论上规避镀铜附着性差的风险。MG50CH含钛焊丝实施“化学镀铜+电镀铜”的改良工艺,获得了良好的镀铜附着性,焊接性能良好,满足了用户的特殊需求。
The quality of copper plating layer affects directly welding performance of wire.Thickness and adhesion are two important quality characteristics of copper plating layer.Chemical copper plating has thin coating,uniform and dense copper plating,making it easy to obtain excellent copper plating adhesion.If thicker copper plating layer is to be obtained,titanium containing wire is not suitable for chemical copper plating.Although electrical copper plating can ensure thickness of copper plating layer,it is accompanied by slight degree of chemical displacement reaction,which can have adverse effects on adhesion of copper plating.In order to suppress chemical displacement reaction,first thin copper layer can be coated before implementing electrical copper plating,avoiding risk of poor adhesion in theory.MG50CH titanium containing welding wire has implemented improved process of chemical copper plating+electrical copper plating,which has achieved good copper plating adhesion and good welding performance,to meet special needs of users.
作者
唐晓梅
Tang Xiaomei(Kobelco Welding of Tangshan Co.,Ltd.,Tangshan 063020,China)
出处
《金属制品》
CAS
2024年第3期9-13,共5页
Metal Products
关键词
实心焊丝
化学镀铜
焊接性能
附着性
置换反应
solid welding wire
chemical copper plating
welding property
adhesion
chemical displacement reaction