抗坏血酸对锂电铜箔抗氧化性能的影响

Effect of Ascorbic Acid on Oxidation Resistance of Electrolytic Copper Foil

抗坏血酸(AA)作为一种包含多个羟基的有机配体,易与金属Cu离子螯合形成配位聚合物附着于铜箔表面。采用抗坏血酸为钝化剂,以浸渍法在电解铜箔表面构建了钝化膜,探究不同浓度钝化液对铜箔表面高温防氧化性能的影响,发现10 g/L抗坏血酸可显著提高锂电铜箔的耐蚀性。通过电化学及相关表征试验研究了表面膜的钝化性能,结果表明,钝化膜的自腐蚀电流密度逐渐降低,电压升高,且高频区的半径增大,具有良好的抗氧化性能。此外,钝化膜表面光滑致密,有效阻挡了腐蚀介质的侵蚀,仍能使铜箔保持良好的工艺性能。该钝化工艺操作简单且成本较低,具有良好的工业应用前景。

Ascorbic acid(AA)as an organic ligand containing multiple hydroxyl groups,is easy to chelate Cu ions to form a coordination polymer attached to the surface of copper foil.Ascorbic acid was used as passivation agent to construct passivation film on surface of electrolytic copper foil by immersion method.The effect of passivation liquid with different concentrations on the oxidation resistance of copper foil surface at high temperature was investigated.It is found that 10 g L ascorbic acid could significantly improve the corrosion resistance of electrolytic copper foil.The passivation performance of the surface film was studied by electrochemical and related characterization tests.The results show that the self-corrosion current density of the passivated film drops gradually,the voltage increases,and the radius of the high frequency region increases,which have good oxidation resistance.In addition,the surface of the passivation film is smooth and dense,which effectively blocks the erosion of the corrosive medium and can still maintain good process performance of the copper foil.The passivation process is simple in operation and low in cost,and has a good industrial application prospect.