摘要
文章介绍了高频UPS和锂电池在半导体工厂实际负载工况应用场景下的性能测试。从供电可靠性、安全高效、易扩容、易维护等方面评估了高频模块化UPS,说明了高频模块化UPS应用于半导体晶圆制造厂中,对含有冲击性电流的感性负载的良好适用性。
The article describes the performance tests of transformerless UPS in the application scenarios of actual conditions in semiconductor fabs.The transformerless modular UPS is evaluated in terms of power supply reliability,safety,efficiency,scalability,and maintainability.This test illustrates the good suitability of the modular UPS applied to some inductive loads with inrush currents in semiconductor wafer fabs.
作者
钟辉明
安真
韩本杰
殷星
吕璐
张建洪
Zhong Huiming;An Zhen;Han Benjie;Yin Xing;Lv Lu;Zhang Jianhong(Huawei Digital Power,Shenzhen 518043,China)
出处
《智能建筑电气技术》
2024年第3期93-97,共5页
Electrical Technology of Intelligent Buildings
关键词
高频UPS
感性负载
可靠性
transformerless UPS
inductive load
reliability