应用微波网络分析的界面刚度超声检测研究

Ultrasonic Testing of Interface Stiffness Based on Microwave Network Analysis

界面刚度是表征装配结构性能的重要参数,作为常见的无损检测方式,超声检测被广泛应用于界面刚度检测,但现有界面刚度超声检测仍存在一定不足。对现有实验方法进行改良,在传统超声检测理论基础上,将微波网络分析从电磁波领域迁移到超声波领域,将“场”理论与“路”理论相结合,通过检测微波网络分析仪S参数表征界面刚度,并与软件有限元仿真和传统超声检测实验结果进行对比,对界面刚度进行检测与评价。研究显示,相比于传统超声检测,使用微波网络S参数表征接触界面刚度时,检测方法简化实验流程,且检测结果更符合实际接触情况。微波网络分析与超声检测相结合的检测方法在重大装备关键装配界面接触情况测试中具有重要应用前景。

Interface stiffness is an important parameter to characterize the performance of assembly structure.As a common nondestructive testing method,ultrasonic testing is widely used in interface stiffness testing,but the existing ultrasonic testing of interface stiffness still has some shortcomings.On the basis of traditional ultrasonic testing theory,the microwave network analysis is transferred from electromagnetic wave field to ultrasonic field.The“field”theory and“path”theory are combined.The interface stiffness is characterized by measuring the S parameters of microwave network analyzer.The results are compared with the results of software finite element simulation and traditional ultrasonic testing experiment,The interface stiffness is tested and evaluated.The results show that,compared with the traditional ultrasonic testing,when the S-parameter of microwave network is used to characterize the contact interface stiffness,the testing method simplifies the experimental process,and the testing results are more consistent with the actual contact situation.The combination of microwave network analysis and ultrasonic testing has an important application prospect in the contact test of key assembly interface of major equipment.