镀银板表面粗糙度对纳米银焊膏快速烧结互连质量的影响

Effect of Surface Roughness of Silver-Plated Plates on the Quality of Rapidly Sintered Interconnections with Nano Silver Solder Paste

通过施加15 MPa的压力,在265℃空气气氛下使用预制完成的镀银板表面印刷纳米银焊膏组装的三明治结构制备烧结银连接层。研究了3种铜镀银板表面粗糙度对烧结银连接界面结合强度的影响。研究结果表明,烧结时间为8 min、镀银板算术平均表面粗糙度为1.630μm、最大粗糙度深度为12.030μm时,可以有效促使烧结银连接层与基板表面形成高强度的冶金连接和机械联锁,最终获得了61.09 MPa的高剪切强度,表明烧结银层与烧结界面的结合强度得到了较大提升。研究结果可为选择合适的基板粗糙度提供实验依据,从而获得高强度、高可靠性的低温快速烧结银互连接头。

By applying the pressure of 15 MPa,the sintered silver connection layer is prepared using the sandwich structure assembled by nano silver solder paste printed on the surface of the prefabricated silver-plated plate under an air atmosphere of 265℃.The effect of surface roughness of three types of copper silver-plated plate on the bonding strength at the interface of sintered silver connection is studied.The research results show that the sintered time is 8 min,the arithmetic average surface roughness of the silver-plated plate is 1.630μm,and the maximum roughness depth is 12.030μm,which can effectively promote the formation of high-strength metallurgical connection and mechanical interlocking between sintered silver connection layer surface and the substrate surface.In the end,the high shear strength of 61.09 MPa is obtained,indicating that the bonding strength between sintered silver layer and the sintered interface is greatly improved.The research results can provide experimental basis for selecting suitable substrate roughness,thereby obtaining high-strength and highly reliabie low-temperature and rapidly sintered silver interconnect joints.