面向快速散热的HTCC基板微流道性能研究

Research on Performance of HTCC Substrate Microfluidic Channel for Rapid Heat Dissipation

随着微波组件向着大功率、高密度集成方向的快速发展,组件中大功率芯片的散热问题已影响到组件的可靠性,解决大功率微波组件的散热问题需要采用高效的散热技术。作为新兴的快速散热技术之一,微流道具有低热阻、高效率以及可集成等众多优势。建立了基于大功率微波组件的微流道陶瓷基板有限元分析模型并对其进行热仿真,分析了不同微流道构型、占空比、扰流柱半径以及流速对组件散热的影响,并基于仿真结果制备了实物组件,实测温升下降60℃,实现了超大功率芯片的快速散热。

With the rapid development of microwave components towards high power and high density integration,the heat dissipation problem of high power chips in the components has affected the reliability of the components,and the solution of the heat dissipation problem of high power microwave components requires the use of high-efficiency heat dissipation technology.As one of the emerging fast heat dissipation technologies,microfluidic channel has many advantages such as low thermal resistance,high efficiency and integration.The finite element analysis model of microfluidic channel ceramic substrate based on high power microwave components is established,and the thermal simulation is carried out to analyze the effects of different microfluidic channel configurations,duty cycles,perturbation column radius and flow rates on the heat dissipation of the components.The physical components are prepared based on the simulation results,the measured results of the temperature rise decreases by 60℃,thus realizing the rapid heat dissipation of ultra high power chip.