摘要
中国电子信息产业发展迅速,集成电路已成为国民经济建设的重要基础产业之一。本文综述了集成电路引线框架用铜合金的发展现状,梳理了引线框架用Cu-Fe-P, Cu-Cr-Zr, Cu-Ni-Si等合金体系的特性及多元微合金化对铜合金组织和性能的影响,阐述了引线框架用铜合金带材的制备加工方法,介绍了以水平连铸为核心的短流程生产新工艺的特点,并展望了中国集成电路引线框架用铜合金的发展前景和方向。
China's electronic information sector is experiencing rapid growth,with integrated circuits emerging as a pivotal foundation for the nation's economic infrastructure.This article encapsulates the current standing of copper alloys utilized in IC leadframes,sys⁃tematically reviews the distinctive attributes of alloy systems such as Cu-Fe-P,Cu-Cr-Zr,Cu-Ni-Si tailored for leadframes,alongside the effects of intricate micro-alloying techniques on the structure and performance attributes of these copper alloys.It further delineates the fabrication and processing methodologies employed for leadframe copper alloy strips,shedding light on the innovative features of a novel,streamlined production process centered around horizontal continuous casting.Lastly,it offers insights into the future prospects and trajectory of development for IC leadframe copper alloys within the Chinese context.
作者
姜雁斌
黄承智
李周
刘新华
娄花芬
肖柱
刘峰
莫永达
张嘉凝
JIANG Yanbin;HUANG Chengzhi;LI Zhou;LIU Xinhua;LOU Huafen;XIAO Zhu;LIU Feng;MO Yong-da;ZHANG Jianing(School of Materials Science and Engineering,Central South University,Changsha 410083,China;Key Laboratory of Advanced Material Preparation Technology,Ministry of Education,University of Science and Technology Beijing,Beijing 100083,China;China Aluminum Science and Technology Research Institute Co.Beijing 102209,China;Provincial Engineering Research Center for High Performance Copper-based New Materials,Ningbo Xingye Shengtai Group Co.,Ningbo 315336,China)
出处
《铜业工程》
CAS
2024年第3期131-144,共14页
Copper Engineering
基金
国家重点研发计划项目(2021YFB3803103)
国家自然科学基金项目(U2202255,51925401)
湖南省科技创新领军人才项目(2023RC1019)资助。
关键词
集成电路
引线框架
铜合金
制备技术
发展趋势
integrated circuits
leadframes
copper alloys
preparation technology
development trend
