基于倒装焊的大尺寸芯片塑封工艺研究

Research on Plastic Packaging Technology for Large-Size Chips Based on Flip-chip Bonding

基于倒装焊的大尺寸芯片塑封工艺,研究了4000 pin级电路封装工艺试验,对大尺寸芯片倒装、回流焊接、底填以及4000 pin级植球等关键工艺步骤进行了研究和评估。工艺试验结果表明工艺能力可以较好地覆盖4000 pin级倒装芯片球栅格阵列(FCBGA)电路塑料封装。可靠性测试结果表明,4000 pin级FCBGA塑料封装电路高温贮存(150℃)可达1000 h,温循寿命(-65℃~150℃)可达500次,强加速稳态湿热试验(130℃/85%)可达96 h,且环境试验后的电路通断测试正常。

The study focused on testing the packaging technology of large-size chips using flip chip bonding,specifically examining the flip-chip,reflow soldering,underfill application,and 4000 pin-level ball planting process.The results show that the process capability can well cover the plastic package of the 4000 pin FCBGA circuit.The reliability test results show that the 4000 pin FCBGA plastic packaging circuit can be stored at high temperature(150℃)for 1000 hours,the temperature cycle life(-65℃~150℃)can reach 500 times or more,the time of highly accelerated stress test(130℃/85%)can reach 96 hours.After the environmental test,the circuit open/short test passed.