车规级功率器件的封装关键技术及封装可靠性研究进展

Research Progress on Packaging Key Technologies and Packaging Reliability of Automotive-Grade Power Devices

半导体技术的进步推动了车规级功率器件封装技术的不断发展和完善,然而车规级功率器件应用工况十分复杂,面临高度多样化的热循环挑战,对其可靠性提出了更高的要求。因此,在设计、制造和验证阶段都必须执行更为严格的高功能安全标准。综述了车规级功率器件的封装关键技术和封装可靠性研究进展,通过系统地归纳适应市场发展需求的车规级功率器件封装结构,总结了封装设计关键技术和先进手段,同时概述了封装可靠性研究面临的挑战。深入探讨了车规级功率器件封装设计和封装可靠性的重要问题,在此基础上,借鉴总结已有的研究成果,提出了可行的解决方案。

The progress of semiconductor technology has promoted the continuous development and improvement of packaging technology of the automotive-grade power device.However,the application conditions of automotive-grade power devices are very complex,and they are faced with highly diverse thermal cycling challenges,which puts forward higher requirements on their reliability.Therefore,more stringent high functional safety standards need to be implemented in the design,manufacturing and verification stages.The research progress on packaging key technologies and packaging reliability of automotive-grade power devices is reviewed.The key technologies and advanced methods of packaging design are summarized by systematically summarizing the packaging structures of automotive-grade power devices that meet the needs of market development,and the challenges of packaging reliability research are also overviewed.The important problems of packaging design and packaging reliability of automotivegrade power devices are deeply discussed.Based on the existing research results,the feasible solutions are put forward.