一种20GHz四通道差分传输CQFN外壳

A 20 GHz Four-Channel Differential Transmission CQFN Package

基于高温共烧陶瓷(HTCC)技术,设计了一款适用于四通道差分信号并行传输的高密度陶瓷四边无引线扁平(CQFN)外壳。差分传输的垂直结构采用侧面城堡结构和金属化过孔相结合的设计,该结构可以在保证差分信号传输质量的同时,兼顾外壳的板级安装可靠性,同时在该结构基础上对金属化过孔直径以及多通道并行结构进行仿真和优化。测试结果表明,在DC~20 GHz频段,该CQFN外壳的单通道差分传输结构的回波损耗≤-10.00 dB,插入损耗优于-1.50 dB,验证了该外壳可以有效地保证信号的完整性。利用实测数据进行信号传输验证,结果表明四通道差分传输结构可支持20 GHz信号传输。

Based on high-temperature co-fired ceramic(HTCC)technology,a high density ceramic quad flat no-lead(CQFN)package for four-channel differential signal parallel transmission was designed.The vertical structure of the differential transmission adopted a design that combined the sidecastle structure and metallized vias.This structure can ensure the transmission quality of the differential signal while considering the board-level installation reliability of the package.Meanwhile,based on the structure,the diameter of the metallized vias and the multi-channel parallel structure were simulated and optimized.The test results show that within the frequency range of DC-20 GHz,the return loss of the single-channel differential transmission structure is≤-10.00 dB and the insertion loss is better than-1.50 dB for the CQFN package,it is verified that the package can effectively guarantee the signal integrity.The measured data are used to verify the signal transmission,and the results show that the four-channel transmission structure can support 20 GHz signal transmission.