某高频段瓦式相控阵天线的热设计与试验分析

Thermal design and experimental analysis of a high frequency tiled phased array antenna

随着通信技术的快速发展,瓦式相控阵天线以其小型化、高性能、高集成的特点,已逐渐成为有源相控阵天线发展的新趋势。但随着频段及集成度的不断提高,多功能集成芯片的热流密度也越来越大,随之带来的散热问题也更为突出。针对某高频段瓦式相控阵天线的热设计要求,提出一种强迫风冷条件下“散热风道+扁平热管”的低成本散热方案,通过数值仿真验证阵面发热器件可控温度及多功能集成芯片温度一致性,搭建热测试平台进行热测试,对测试点实测温度与仿真温度进行对比分析。数值仿真和试验结果表明:所设计的热控结构能够满足发热器件的壳温要求以及多功能集成芯片的温度一致性要求,进一步验证了该散热方案的合理性,可为后续同类瓦式相控阵天线的热设计提供一定的参考。

With the rapid development of communication technologies,tiled phased array antenna has gradually become a new trend in the development of active phased array antenna because of its characteristics of miniaturization,high performance and high integration.However,with the continuous improvement of frequency band and integration,the heat flux of multifunctional integrated chip is increasing,and the resulting heat dissipation problem is more prominent.According to the thermal design requirements of a high frequency tiled phased array antenna,a low-cost cooling scheme of″heat dissipation duct+flat heat pipe″under forced air-cooling is proposed.The controllable temperature of the array heating device and the temperature consistency of the multifunctional integrated chip are verified by numerical simulation.A thermal testing platform is built to carry out the thermal testing,and the measured temperature at the testing point is contrasted with the simulated temperature.The numerical simulation and experimental results show that the designed thermal control structure can meet the requirements of the shell temperature of the heating device and the temperature consistency requirements of the multifunctional integrated chip,which further verifies the rationality of the heat dissipation scheme.To sum up,the proposed scheme can provide a certain reference for the subsequent thermal design of the similar tiled phased array antennas.