PCB酸蚀刻废液制备氧化铜的工艺优化

Optimization of Copper Oxide Preparation Process from Acid-etching Waste Liquid from PCB

为高效回收酸蚀刻废液中的Cu^(2+)和Cu^(+),对电镀级氧化铜的制备工艺进行了优化,通过正交实验对影响氧化铜产品质量的一级反应器中混合液氧化还原电位(ORP)值、分散剂添加量、二级反应器中混合液ORP值、萃洗次数4个主要因素进行了研究。结果表明,在废液预处理阶段,添加氯酸钠和双氧水的一级反应器中混合液ORP值处于620~650 mV之间,分散剂添加量为250 ppm/10 ppm,二级反应器中混合液ORP值维持在525~575 mV之间时,有利于提高产品氧化铜的含量,降低产品杂质含量。本研究为酸蚀刻废液高效利用提供了一种可行且简便的方法。

In order to efficiently recover Cu^(2+) and Cu^(+) from acid etching wastewater,an electroplating grade copper oxide preparation process was proposed.Orthogonal experiments were used to study the four main factors affecting the quality of copper oxide products,including the oxidation-reduction potential(ORP)value of the mixed solution in the primary reactor,the amount of dispersant added,the ORP value of the mixed solution in the secondary reactor,and the number of extractions.The results showed that in the pre-treatment stage of waste liquid,when the ORP value of the mixed solution in the primary reactor with sodium chlorate and hydrogen peroxide added was between 620~650 mV,the dosage of dispersant was 250 ppm/10 ppm,and the ORP value of the mixed solution in the secondary reactor was between 525~575 mV,which was beneficial for increasing the content of copper oxide in the product and reducing impurity content.This study provides a feasible and convenient method for the efficient utilization of acid etching wastewater.