摘要
阐述封装基板的特点,刚性基板和柔性基板在材料、性能方面的区别,并选取FCBGA基板、无芯基板以及埋嵌芯片技术作为分析对象,详细分析封装基板技术在微电子产品中的实际应用。
This paper describes the characteristics of packaging substrates,the differences in materials and properties between rigid and flexible substrates,and selects FCBGA substrates,coreless substrates,and embedded chip technologies as the analysis objects to analyze in detail the practical application of packaging substrate technology in microelectronic products.
作者
张凤
ZHANG Feng(Nanjing Weimeng Electronics Co.,Ltd.,Jiangsu 210023,China)
出处
《集成电路应用》
2024年第6期8-9,共2页
Application of IC
关键词
封装基板技术
刚性基板
柔性基板
FCBGA基板
无芯基板
埋嵌芯片技术
packaging substrate technology
rigid substrate
flexible substrate
FCBGA substrate
coreless substrate
embedded chip technology
