弹上电子产品加固防护可靠性分析研究

Research on reliability analysis of reinforced protection technology for BGA package components of on-missile electronic products

提出一种弹上电子产品球栅阵列封装元器件的新型加固防护工艺方法,对使用不同加固防护方法的电子产品进行了随机振动试验与有限元仿真分析,研究对球栅阵列封装(BGA)元器件焊点可靠性的影响;采用Steinberg疲劳寿命模型分析焊点的疲劳寿命。研究表明,纳米疏水剂、四角点胶配合3D打印壳体封装的组合新型弹上电子产品加固防护方法能有效提升产品可靠性。

A new reinforcement and protection process technology for on-missile electronic products of missiles and rockets is proposed.Random vibration experiment and finite element analysis(FEA)are carried out on electronic products with different reinforcement methods to study the effects on the reliability of ball grid array(BGA)package solder joints.The fatigue life of solder joints is analyzed based on Steinberg fatigue life model.The simulation and experimental results show that the new combined protection method of on-missile electronic products,which is protected by nano hydrophobic agent,four corner dispensing method and 3D printed shell encapsulation,can effectively improve product reliability.