摘要
CQFP陶瓷封装是一种常用的封装技术,用于集成电路器件的保护和封装。封装材料的选择和工艺的优化对CQFP封装的性能和可靠性至关重要。本文对CQFP封装中封装材料的选择和工艺的优化进行了综述。研究成果对CQFP封装的应用和进一步研究具有一定参考价值。
CQFP ceramic packaging is a common packaging technology,which is used for the protection and packaging of integrated circuit devices.The selection of packaging materials and process optimization are very important for the performance and reliability of CQFP packaging.In this paper,the selection of packaging materials and the optimization of process in CQFP packaging are reviewed.The research results have certain reference value for the application and further research of CQFP packaging.
作者
王洋
Yang Wang(Lianyungang Jerry Electronics Co.,Ltd.,Lianyungang,Jiangsu 222006,China)
出处
《产业科技创新》
2024年第3期68-71,共4页
Industrial Technology Innovation
关键词
CQFP陶瓷
封装材料
工艺优化
CQFP ceramics
Packaging materials
Process optimization
